Microchip: SAM R30 system-in-package for wirelessly connected designs
Microchip announces the SAM R30 System in Package (SiP), a single-chip RF microcontroller which incorporates an ultra-low power microcontroller with an 802.15.4 sub-GHz radio to provide multi-year battery life in a compact 5 mm package. The SAM R30 SiP delivers design flexibility and proven reliability all in a small package, making it ideally suited for connected home, smart city and industrial applications. The SiP is built using the SAM L21 MCU which leverages the Cortex M0+ architecture, the most energy efficient ARM-based architecture available. The SAM R30 features ultra-low power sleep modes, with wake from serial communication or General-Purpose Input/Output (GPIO) while consuming a mere 500nA.
With the ability to operate within the 769-935 MHz range, the SAM R30 SiP gives developers the flexibility to implement a point-to-point, star or mesh network. Microchip helps developers get started immediately with the free MiWi point-to-point/star network protocol stack. Mesh networking capabilities will be available later this year. Nodes outfitted with the SiP can be positioned as far as one kilometer apart, with the ability to double the range in a star topology. When used in a mesh network, the SAM R30 delivers reliable wide-area coverage for applications such as street lighting or wind and solar farms.
The ATSAMR30-XPRO convenient USB-interfaced development board is supported by the easy-to-use Atmel Studio 7 Software Development Kit. The SAM R30 SiP is available in two QFN packages to be sampled or purchased in volume production quantities.