Toshiba Electronics Europe released the TCR3UG series of small package, low-dropout regulators with an output current of 300mA, that are suitable for power management of IoT modules, wearable devices ...
Express Logic announced that its ThreadX SMP RTOS has achieved the highest level of SGS-TÜV Saar certification for embedded development in safety-critical systems using symmetric multicore proces...
Atlantik Elektronik presents the highly integrated wireless embedded IoT gateway. Measuring less than the size of a postage stamp, the compact xPico 200 embedded IoT gateways deliver robust Ethernet, ...
Panasonic Industry Europe has recently launched a fully embedded stand-alone Wi-Fi module for highly integrated and cost-effective applications. The PAN9420 device is a 2.4GHz 802.11 b/g/n fully embed...
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Conrad introduces the new IoT starter kit C-Control 10. Developed in collaboration with Elco Industrie Automation and Microtronics, the kit simplifies entry into the Internet of Things market, Industr...
Security gaps like Meltdown and Spectre show once again that relying on the standard security mechanisms of hardware and operating system is not enough. For distributed IoT devices in particular, inst...
GrammaTech announced that mitigation against Spectre attacks has been added to GrammaTech’s Cyber Hardening Services for Intel and AMD processors, with support for ARM in development. This servi...
SEGGER's emWeb web server is an easy way to provide a browser interface to any kind of device, service or software module. Written entirely in C, it easily integrates into any existing application...
INSYS icom has joined Microsoft Azure Certified for Internet of Things, ensuring customers get IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to ...
Express Logic announces that its industrial-grade X-Ware IoT Platform is an official Thread Certified Product and the only such solution from an independent RTOS provider. Created by the Thread Group,...
Rutronik Elektronische Bauelemente will be hosting two booths at embedded world 2018 with a focus on the Internet of Things, security and sensing. RUTRONIK EMBEDDED offers visitors system concepts ...
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Under the theme “From Sensor to Sunset,” Arrow Electronics will display its comprehensive, fully integrated IoT portfolio at Embedded World, including sensors, wireless connectivity, gatew...
Qorvo is helping seniors live more independently in their homes with a new eHealth system powered by the company’s chipsets for the Internet of Things. Health insurer CZ will provide the system ...
IAR Systems announces tool support for the new LPC54018 MCU-based IoT module from NXP Semiconductors. Using the leading development toolchain IAR Embedded Workbench for Arm will enable developers to q...
ams introduced the AS39513 NFC sensor tag and data logger IC for smart labels which enables more efficient and accurate monitoring of the condition of assets such as food, pharmaceuticals and healthca...
Mouser Electronics is now stocking the RSL10 multi-protocol system-on-chip from ON Semiconductor. Offering ultra-low-power wireless connectivity for a broad range of applications, the versatile Blueto...
Panasonic Industry Europe is introducing a highly-integrated, embedded dual-mode Bluetooth 4.2 RF module delivering high-speed operation at ultra-low power consumption. The PAN1026A is based on Toshib...
ADLINK Technology introduces a robust and reliable IIoT-ready combination embedded controller and IoT gateway. ADLINK’s MXE-210 offers a small footprint and is fully operable in harsh environmen...
The more connectivity and automated driving functions are built into cars, the more important embedded IT security becomes for vehicle communication. Infineon Technologies and ESCRYPT work closely tog...
Virtual Conference: Technical Trends with Wide Bandgap SemiconductorsWe are facing higher switching frequency and higher operating temperatures. Wide Band Gap Semiconductors can accommodate these increasing demands by permitting better performance than today’s silicon. Passive components from heat sinks, capacitors and coils get smaller. The overall benefit is reduced sizes for the total systems in all applications. However, the challenges are having improved measurement equipment available and to analyze the designs correctly.
At embedded world 2018, Real-Time Innovations will feature the latest version of their connectivity software for real-time applications, Connext DDS 5.3. The company will also discuss their enhanced s...
The theme of the nVent Schroff booth at Embedded World 2019 was “Experience Expertise – Modularity, Performance, Protection and Design”. Join us as our experts give an overview of th...
Through its US subsidiary, located in Minnesota, Garz & Fricke is providing support for its growing HMI and Panel-PC business in the USA and Canada while also strengthening its presence in North A...
In a much larger stand than in previous years, at embedded world 2019 SECO showcases its wide range of solutions and services for the industrial domain and IoT. Among the main innovations, in this vid...
Since about two years Portwell is part of the Posiflex Group. Together with KIOSK, the US market leader in KIOSK systems, the Posiflex Group is a strong player in the Retail, KIOSK and Embedded market...
Florian Freund, Engineering Director DACH at Arrow Electronics talks us through Arrow’s transformation from distributor to Technology Platform Provider and how Arrow is positioned in both, Custo...
Arm’s Platform Security Architecture (PSA) has taken a step forward with the launch of PSA Certified, a scheme where independent labs will verify that IoT devices have the right level of securit...
The DIN-Rail system from MEN is a selection of individual pre-fabricated modules that can variably combine features as required for a range of embedded Rail Onboard and Rail Wayside applications. The ...
The adoption of graphics in embedded and AI applications are growing exponentially. While graphics are widely available in the market, product lifecycle, custom change and harsh operating environments...
With increasing complexity of applications, no single type of computing core can fulfill all application requirements. To optimize AI performance at the edge, an optimized solution will often employ a...
The UDE Multi-Target Debug Solution from PLS provides synchronous debugging of AURIX multi-chip systems. A special adapter handles the communication between two MCUs and the UAD3+ access device and pr...
To meet all requirement of vertical applications, ADLINK’s Smart Panel is engineered for flexible configuration and expansion to reduce R&D time and effort and accelerate time to market. The...
Morten Kreiberg-Block, Director of Supplier & Technology Marketing EMEA at Arrow Electronics talks about the power of AI and enabling platforms. Morten shares some examples of traditional designin...
Andrew Bickley, Director IoT EMEA at Arrow Electronics talks about challenges in the IoT world and how Arrow is facing those through the Sensor to Sunset approach. Over the lifecycle of the connected ...
AAEON is moving from creating the simple hardware to creating the great solutions within Artificial Intelligence and IoT. AAEON is offering the new solutions for emerging markets, like robotics, drone...
Amir Sherman, Director of Engineering Solutions & Embedded Technology at Arrow Electronics talks about the transition started couple of years ago from a components’ distributor to Technology...
David Spragg, VP, Engineering – EMEA at Arrow Electronics talks about improvements in software and hardware enabling to utilize the AI capabilities. David shares how Arrow with its solutions is ...
In this video Robert Green from ASIC Design Services describes their Core Deep Learning (CDL) framework for FPGA design at electronica 2018 in Munich, Germany. CDL technology accelerates Convolutional...
In this video Caesar from Microchip talks about the company's latest smart home solutions at electronica 2018 in Munich, Germany. One demonstrator shown highlights the convenience and functionalit...
In this video Infineon talks about their new CoolGaN 600 V e-mode HEMTs and GaN EiceDRIVER ICs, offering a higher power density enabling smaller and lighter designs, lower overall system cost. The nor...
In this video Frederik Dostal from Analog Devices explains a very high-efficiency charge-pump demonstration at their boot at electronica 2018 in Munich, Germany. Able to achieve an operating efficienc...
This article describes the value of test & measurement systems based on examples from various real-world applications. The most important requirements and criteria for everything from system architecture and mechanical systems to enclosures with a small form factor and 19" systems with electronics cabinets are explored.
Going way beyond what conventional electro-mechanical components can achieve, MEMS devices are now seeing huge market uptake across a broad spectrum of industry sectors - from automotive to consum...
Most organizations do not consider production test a top priority, but it is a necessity to prevent major quality issues in the products that represent the company brand in the hands of customers....
The urgency of IIoT security is becoming ever more apparent, and embedding the highest levels of trust is now essential. The editors at AspenCore have compiled a series that will help you un...
With multi-function sensors and miniaturized connectors, embedded antennas and lightweight wire, engineers can build next-generation infotainment applications that enable smarter experiences for...
As automotive designs move to electrification, high-wattage power electronics become critical components in the new electronic drivetrain and battery systems. In these devices, galvanic isolatio...
As electronic systems become more miniaturized, mobile and complicated, power requirements become more varied. Available battery voltages and required operating voltages, as well as size and shape...
In the paper we present the design and development of the Machine Learning (ML) modules for two case studies. In both cases we developed a ML model to learn the system’s normal behavior so t...
In this article, we discuss the characteristics of active-clamp forward and continuous-conduction flyback isolated power supply topologies and demonstrate the design and performance trade-offs of ...
Autonomy and electrification are demanding significant changes to electrical and electronic architectures within vehicles. This is due in part to the introduction of high voltages, increased safety considerations and significant weight reductions needed to maximize vehicle range from electrification...
There are many challenges in circuit design today and understanding the key differences between digital isolators and opto-coupled isolators in circuit design helps developers design more effectively. This whitepaper reviews the challenges of modern circuit design...
In addition to signal frequency and bandwidth, the signal linearity and chirp duration determine radar performance. It is therefore important to analyze automotive radar signal parameters such as chirp length, chirp rate and frequency deviation.
Driven by the need for ever greater efficiency, lower cost, and improved safety, automobiles are undergoing a revolution in power distribution network (PDN) design. From architectures to semiconductor solutions and underlying processes, this one-hour EETimes University course will provide attendees with an overview of what’s changing, why, and what designers can do about it as they approach next-generation automotive PDN design.
Developers today want to add rich Wi-Fi and Bluetooth connectivity to their products to enhance their applications and end-customer experience, but they face many challenges that can slow down the process and delay time to market. This whitepaper discusses the unique challenges presented...
Industry is placing ever-greater emphasis on automation, particularly with the increasing deployment of Industry 4.0 technology. The latest developments in machine vision systems open up opportunities for the manufacturing sector to raise quality and throughput simultaneously. Furthermore, new applications are starting to appear in other industries, e.g. object detection and...
A smart meter is an electronic device that records and reports, via some kind of communications network, the consumption of a utility service, such as the supply of electricity, gas, water, or heating/cooling. In this whitepaper, we explore the fundamentals of smart metering and some of the benefits and challenges that come with...
As the global energy mix transforms to adopt low-carbon energy sources and energy-efficient transportation, pressure mounts for energy efficient cars. Today, the overall Electric Vehicle (EV) market already outpaces the conventional Internal Combustion Engine (ICE) vehicle market growth rate...
The future of artificial intelligence (AI) relies on advances in the underlying machine learning technology, and an effective ML architecture. Through research with organizations such as Google, Arm, and leading universities that focus on data science, GigaOm reports on two important factors required to broaden...
There are many reasons to give your embedded system “eyes” and transform it into an embedded vision system. Image aquisition can turn many devices into ‘smart’ products or enable entirely new possibilities. This isn’t just a trend for systems that should work more autonomously; often it’s also an expedient step to make systems more intelligent...
First launched in 2005, the Arduino platform is responsible for making embedded microcontroller development accessible to all. With its simple to use yet comprehensive approach, Arduino has eased the often difficult task of interfacing an embedded application to the real world of hardware devices. Arduino also heralded in an open source era which accelerated widespread adoption of the platform’s design, spawned a separate market of add-on extension boards and a host of developer communities. In this article we take a quick look at the Arduino’s evolution so far and review some of the most recent additions to the Arduino ecosystem of open source hardware.
Nowadays “Industry 4.0” machines are interconnected, which means, they operate with other machines. In this time of mass customization, you need configurable and smart controllers, which can operate different tasks, by adding or removing features or modules. This presentation will explain how to design and build modular and scalable machines based on a Plug&Play EtherCAT stack. A use case will be presented to illustrate this approach.
Challenges common to industrial automation systems – like the demand for power-efficient and industrial grade components with guaranteed long-term availability – influence which solutions best suit industrial applications. Known as the Fourth Industrial Revolution, or Industry 4.0, the future beholds a growing number of industrial automation applications powered by smart semiconductor solutions.
Bluetooth Angle of Arrival (AoA) and Angle of Departure (AoD) are new technologies that establish a standardized framework for indoor locationing. With these technologies, the fundamental problem of locationing comes down to solving the arrival and departure angles of radio frequency signals.
Over the last two decades, Wi-Fi has transformed connectivity with more than 15 billion installed devices in the world. Such a broad and pervasive installed base, along with its throughput capabilities and native IP capabilities, makes Wi-Fi an attractive protocol for IoT wireless applications. However, a key limitation of most Wi-Fi based IoT systems is high power consumption.
Non-stop growth in design size and complexity makes it more difficult than ever for verification teams to keep up with project demands and product goals. According to the Synopsys 2017 Global User Survey, “Verification taking longer than planned” is the top reason for tapeout delays, and “Simulation runtime performance” is the top challenge for verification.
Enterprises in every industry are gearing up for AI’s integration with IoT at the edge. Analytics and cloud-based applications are crucial foundations for the AIoT infrastructure. But even more importantly, AIoT requires complete, real-time access to the data in fulfill the needs of highly responsive edge computing applications.
This paper provides an overview of RADAR technology as used in ADAS applications, including a summary of the relevant signal processing, typical computation requirements, and design parameters. This paper also considers approaches to estimating computational complexity and processing resource requirements and addresses some other system design tradeoffs.
n this Webinar you will learn how Arrow’s design tools can accelerate your design and development process by providing you with solutions based on the latest technologies and protocols. Made in cooperation with leading suppliers, Arrow’s development boards enable rapid integration of the newest technologies in your design.
This talk discusses Edge Computing and the migration of Artificial Intelligence & Machine Learning from Cloud-hosted methodologies to running on IoT and edge devices in the field. When it comes to the Internet of Things, we all know everything from your toaster to your car is becoming more connected and intelligent.
Learn how Arrow enables customers to address big business challenges and start the journey to a digital transformation of their business with advanced tools and services. Arrow’s Distribution capabilities now extend to supporting customers with complete Technology Platforms and Solutions.
This webinar introduces Winbond’s High-Performance Serial NAND technology which is the first in the world to run at 166MHz, and is well-suited for center-display and cluster segments in next-generation Highly-Automated Vehicles-HAVs, and other applications that require instant-boot and high throughput.
This White Paper explores how by using SDR, engineers can build radios that can react more readily to interference, employ more sophisticated channel-coding schemes to increase data rates, and take advantage of other advanced RF technologies. English Version / German Version
